Features:Low loss and high attenuation;
Ultra small size;
Light weight and low profile;
For RFFE module use;
Application:4G LTE, 5G, etc.
WLP
Features:Low loss and high attenuation;
Ultra small size;
Light weight and low profile;
RoHS compliant;
High resistance to molding pressure;
For RFFE module use;
Application:4G LTE, 5G ,etc.
CSP
Features:Low loss and high attenuation Small size and light weight;
RoHS compliant;
Application:4G LTE, 5G, etc.
CSP
Features:Compact (1.4 x 1.1 x 0.5 mm typ., );
RoHS compliant;
MSL3;
Application:IMS, LPWA, etc.
Ceramic
Features:Compact (3.0 x 3.0 mm typ., );
RoHS compliant;
MSL1;
Application:IMS, LPWA, etc.
CSP
Features:Ultra compact (1.4 x 1.1 x 0.56 mm typ., );
RoHS compliant;
AEC-Q200 compliant;
MSL3;
Application:Navigation system;
Bluetooth low energy;
CSP
Features:Ultra compact (1.5 x 1.1 x 0.57 mm typ., );
RoHS compliant;
AEC-Q200 compliant;
MSL3;
Application:GNSS Antenna;
Ceramic
Features:Compact (3.0 x 3.0 x 1.05 mm typ., );
RoHS compliant;
AEC-Q200 compliant;
MSL1;
Application:Body control module(RKE,TPMS);
Navigation system;
Bluetooth low energy etc.
Land Mobile
Features:Compact (3.0 x 3.0 mm typ., );
2in1 filter;
RoHS compliant;
MSL1;
Application:Land Mobile
Basesation
Features:Compact (3.0 x 3.0 mm typ., );
RoHS compliant;
MSL1;
Application:4G LTE, 5G, etc.
Copyright ? 2022 Sito Microelectronics Technology (AnHui) Co. All Rights Reserved.皖ICP備2023003321號-1
